MAX32_ _AUT.............................................. -40°C to +125°C
Storage Temperature Range ............................ -65°C to +160°C
Junction Temperature .....................................................+160°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
PARAMETER
POWER SUPPLY
Supply Voltage
Supply Current in Normal
Operation
Supply Current in Shutdown Mode
DRIVER
(V
CC
= +3.3V ±5%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Notes 1, 2)
SYMBOL
V
CC
I
Q
I
SHDN
No load, DI = V
CC
or GND, DE = V
CC
No load, DE = GND
R = 50Ω (RS-422),
Figure 1, DE = V
CC
, T
A
≤ +85°C
DI = GND or V
CC
R = 27Ω (RS-485),
T
A
≤ +85°C
Figure 1, R = 27Ω or 50Ω,
DE = V
CC
(Note 3)
Figure 1, R = 27Ω or 50Ω,
DE = V
CC
, DI = V
CC
or GND
Figure 1, R = 27Ω or 50Ω (Note 3)
-1
1
CONDITIONS
MIN
3.135
TYP
3.300
MAX
3.465
5
10
UNITS
V
mA
µA
2.0
1.5
Differential Driver Output
V
OD
V
CC
V
CC
0.2
+3
0.2
V
Change in Magnitude of
Differential Output Voltage
Driver Common-Mode
Output Voltage
Change in Magnitude of
Common-Mode Voltage
DRIVER LOGIC
Input High Voltage
Input Low Voltage
Input Current
∆
VOD
V
OC
∆V
OC
V
V
V
V
IH
V
IL
I
IN
I
O
DE, DI
DE, DI
DE, DI
Y, Z
DE = GND,
V
CC
= GND or
+3.3V
V
IN
= +12V
V
IN
= -7V
2.0
0.8
-2
-20
-20
+25
-25
-250
+250
160
40
+2
+20
V
V
µA
Output Leakage
µA
+20
mA
mA
°C
°C
kV
Driver Short-Circuit Foldback
Output Current
Driver Short-Circuit
Output Current
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
ESD Protection
I
OSFD
I
OSD
T
TS
T
TSH
(V
CC
- 1V) ≤ V
OUT
≤ +12V, output high
-7V ≤ V
OUT
≤ 1V, output high
0 ≤ V
OUT
≤ +12V, output low
-7V ≤ V
OUT
≤ V
CC
, output high
Y, Z
Human Body Model
±9
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Maxim Integrated
│
2
MAX3293–MAX3295
20Mbps, +3.3V, SOT23 RS-485/
RS-422 Transmitters
Switching Characteristics (MAX3293)
PARAMETER
Driver Propagation Delay
Driver Differential Output Rise
or Fall Time
Driver-Output Skew
Differential Driver-Output Skew
Maximum Data Rate
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
Device-to-Device Propagation
Delay Matching
t
ZH
t
ZL
t
LZ
t
HZ
SYMBOL
t
PLH
t
PHL
t
R
t
F
t
SKEW
t
DSKEW
(V
CC
= +3.3V ±5%, T
A
= +25°C, unless otherwise noted. Typical values are at V
CC
= +3.3V.)
CONDITIONS
Figures 2, 3; R
DIFF
= 54Ω,
C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω,
C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF,
t
SKEW
= | t
PLH
- t
PHL
| (Note 5)
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Same power supply, maximum temperature
difference between devices = +30°C (Note 5)
MIN
400
400
400
400
-400
-100
250
2000
2000
1000
1000
900
TYP
MAX
1300
1300
1200
1200
+400
+100
UNITS
ns
ns
ns
ns
kbps
ns
ns
ns
ns
ns
Switching Characteristics (MAX3294)
PARAMETER
Driver Propagation Delay
Driver Differential Output Rise or
Fall Time
Driver-Output Skew
Differential Driver-Output Skew
Maximum Data Rate
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
Device-to-Device Propagation
Delay Matching
t
ZH
t
ZL
t
LZ
t
HZ
SYMBOL
t
PLH
t
R
t
F
t
PHL
(V
CC
= +3.3V ±5%, T
A
= +25°C, unless otherwise noted. Typical values are at V
CC
= +3.3V.)
CONDITIONS
Figures 2, 3; R
DIFF
= 54Ω,
C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω,
C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF,
t
SKEW
= | t
PLH
- t
PHL
| (Note 5)
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Same power supply, maximum temperature
difference between devices = +30°C (Note 5)
MIN
24
24
10
10
-40
-6
2.5
400
400
100
100
46
TYP
MAX
70
70
70
70
+40
+6
UNITS
ns
ns
ns
ns
Mbps
ns
ns
ns
ns
ns
t
SKEW
t
DSKEW
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Maxim Integrated
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3
MAX3293–MAX3295
20Mbps, +3.3V, SOT23 RS-485/
RS-422 Transmitters
Switching Characteristics (MAX3295)
PARAMETER
Driver Propagation Delay
SYMBOL
t
PLH
t
PHL
t
R
t
F
t
SKEW
t
DSKEW
(V
CC
= +3.3V ±5%, T
A
= +25°C, unless otherwise noted. Typical values are at V
CC
= +3.3V.)
CONDITIONS
Figures 2, 3; R
DIFF
= 54Ω, CL = 50
pF
Figures 2, 3;
R
DIFF
= 54Ω,
C
L
= 50pF
T
A
= -40°C to +125°C
T
A
< +85°C
T
A
= -40°C to +125°C
T
A
< +85°C
5
5
20
16
400
400
100
100
ns
ns
ns
ns
MIN
TYP
MAX
25
25
18.5
15
18.5
15
ns
ns
Mbps
ns
UNITS
ns
Driver Differential Output Rise
or Fall Time
Driver-Output Skew
Differential Driver-Output Skew
Maximum Data Rate
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF,
t
SKEW
= | t
PLH
- t
PHL
|
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF,
T
A
≤ +85°C
Figures 2, 3; R
DIFF
= 54Ω, C
L
= 50pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S1 closed, R
L
= 500Ω,
C
L
= 100pF
Figures 4, 5; S2 closed, R
L
= 500Ω,
C
L
= 100pF
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
t
ZH
t
ZL
t
LZ
t
HZ
Device-to-Device Propagation
Same power supply, maximum temperature
25
ns
Delay Matching
difference between devices = +30°C (Note 5)
Note 1:
Devices production tested at +25°C. Limits over the operating temperature range are guaranteed by design.
Note 2:
All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to device
ground, unless otherwise noted.
Note 3:
∆V
OD
and ∆V
OC
are the changes in V
OD
and V
OC
, respectively, when the DI input changes state.
Note 4:
The maximum current applies to peak current just prior to foldback current limiting.
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