Highly stable 555 timer for generating accurate time delays and oscillation 8-VSSOP 0 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Timer SMT,LM555CMM MSOP8 |
| 模拟集成电路 - 其他类型 | PULSE; RECTANGULAR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电流 (Isup) | 15 mA |
| 最大供电电压 (Vsup) | 16 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LM555CMM | LM555CM | LM555CN | MC1455P1 | NE555V | |
|---|---|---|---|---|---|
| 描述 | Highly stable 555 timer for generating accurate time delays and oscillation 8-VSSOP 0 to 70 | Highly stable 555 timer for generating accurate time delays and oscillation 8-SOIC 0 to 70 | Timers & Support Products Highly stable 555 timer | Timers & Support Products Timer | Timers & Support Products Timer |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | PLASTIC, DIP-8 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 1 | 1 | 8 | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | DIP | DIP | DIP |
| 封装等效代码 | TSSOP8,.19 | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 235 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Brand Name | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 零件包装代码 | SOIC | SOIC | DIP | - | - |
| 针数 | 8 | 8 | 8 | - | - |
| Samacsys Descripti | Timer SMT,LM555CMM MSOP8 | LM555 Time | LM555 Time | - | - |
| 模拟集成电路 - 其他类型 | PULSE; RECTANGULAR | PULSE; RECTANGULAR | PULSE; RECTANGULAR | - | - |
| 长度 | 3 mm | 4.9 mm | 9.817 mm | - | - |
| 功能数量 | 1 | 1 | 1 | - | - |
| 座面最大高度 | 1.1 mm | 1.75 mm | 5.08 mm | - | - |
| 最大供电电压 (Vsup) | 16 V | 16 V | 16 V | - | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - |
| 宽度 | 3 mm | 3.9 mm | 7.62 mm | - | - |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 |
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