Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW65R019C7
MA001043880
PG-TO247-3-44
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
35.362
0.530
0.159
529.068
16.342
19.638
373.119
1571.028
31.874
29.065
1.244
3.111
8.089
3.442
1.033
3438.006
Average
Mass
[%]
0.58
0.01
0.00
8.73
0.27
0.32
6.16
25.92
0.53
0.48
0.02
0.05
0.13
0.06
0.02
56.72
29. August 2013
6061.11 mg
Sum
[%]
0.58
Average
Mass
[ppm]
5834
87
26
8.74
0.27
87289
2696
3240
61560
32.40
0.53
0.48
259198
5259
4795
205
513
0.20
1335
568
170
56.80
567225
567963
1000000
2053
323998
5259
4795
87402
2696
Sum
[ppm]
5834
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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