Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI076N12N3 G
MA000793890
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
8.706
0.851
0.255
849.682
9.679
8.693
95.618
475.191
15.198
0.228
0.001
0.157
0.126
5.996
0.032
0.106
106.210
Average
Mass
[%]
0.55
0.05
0.02
53.90
0.61
0.55
6.06
30.14
0.96
0.01
0.00
0.01
0.01
0.38
0.00
0.01
6.74
29. August 2013
1576.73 mg
Sum
[%]
0.55
Average
Mass
[ppm]
5522
540
162
53.97
0.61
538888
6139
5513
60643
36.75
0.96
301378
9639
145
0.01
0
100
80
0.40
3803
20
67
6.75
67361
67448
1000000
3983
145
367534
9639
539590
6139
Sum
[ppm]
5522
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com