Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ISO1H801G
MA000719956
PG-DSO-36-21
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
19.020
0.383
1.533
30.652
1244.598
3.941
1.438
66.129
651.225
16.150
0.741
0.292
0.151
0.100
9.789
Average
Mass
[%]
0.93
0.02
0.07
1.50
60.83
0.19
0.07
3.23
31.83
0.79
0.04
0.01
0.01
0.00
0.48
29. August 2013
2046.14 mg
Sum
[%]
0.93
Average
Mass
[ppm]
9295
187
749
14980
62.42
0.19
608266
1926
703
32319
35.13
0.79
0.04
0.01
318270
7893
362
143
74
49
0.49
4784
4907
1000000
351292
7893
362
143
624182
1926
Sum
[ppm]
9295
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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