Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ086P03NS3E G
MA001413074
PG-TSDSON-8-2
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
tin
silver
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-31-5
7440-22-4
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.835
0.002
0.008
0.168
6.808
0.036
0.037
1.882
16.357
0.392
0.963
0.037
0.046
1.758
0.001
0.004
0.086
3.501
0.002
0.008
0.151
6.127
Average
Mass
[%]
4.56
0.01
0.02
0.42
16.93
0.09
0.09
4.68
40.70
0.97
2.39
0.09
0.11
4.37
0.00
0.01
0.21
8.71
0.00
0.02
0.38
15.24
7. October 2015
40.21 mg
Sum
[%]
4.56
Average
Mass
[ppm]
45635
52
208
4170
17.38
0.09
169313
885
909
46818
45.47
0.97
2.39
406817
9749
23940
915
1144
4.57
43713
27
107
2145
8.93
87077
47
188
3753
15.64
152388
156376
1000000
89356
45772
454544
9749
23940
173743
885
Sum
[ppm]
45635
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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