Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX9201SG
MA001409748
PG-DSO-12-17
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.425
0.060
0.240
4.792
194.567
1.484
0.310
14.253
140.362
3.243
2.024
0.155
0.124
5.928
Average
Mass
[%]
1.45
0.02
0.06
1.28
52.19
0.40
0.08
3.82
37.63
0.87
0.54
0.04
0.03
1.59
20. August 2015
372.97 mg
Sum
[%]
1.45
Average
Mass
[ppm]
14546
161
642
12848
53.55
0.40
521675
3978
831
38215
41.53
0.87
0.54
376338
8696
5427
416
333
1.66
15894
16643
1000000
415384
8696
5427
535326
3978
Sum
[ppm]
14546
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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