Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE9832QX
MA001408908
PG-VQFN-48-29
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.983
0.018
0.072
1.433
58.193
0.782
0.181
7.656
52.446
2.629
0.614
0.286
0.958
Average
Mass
[%]
3.83
0.01
0.06
1.10
44.67
0.60
0.14
5.88
40.26
2.02
0.47
0.22
0.74
21. September 2015
130.25 mg
Sum
[%]
3.83
Average
Mass
[ppm]
38258
138
550
11003
45.84
0.60
446775
6007
1388
58778
46.28
2.02
0.47
402650
20183
4713
2198
0.96
7359
9557
1000000
462816
20183
4713
458466
6007
Sum
[ppm]
38258
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com