Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD90R1K2C3
MA001145740
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
4.798
0.147
0.044
147.096
0.527
1.390
24.331
113.312
3.740
0.003
1.421
0.096
0.077
3.686
0.019
0.006
19.177
Average
Mass
[%]
1.50
0.05
0.01
46.00
0.16
0.43
7.61
35.42
1.17
0.00
0.44
0.03
0.02
1.15
0.01
0.00
6.00
29. August 2013
319.87 mg
Sum
[%]
1.50
Average
Mass
[ppm]
15000
460
138
46.06
0.16
459860
1647
4347
76064
43.46
1.17
354242
11692
11
0.44
4441
302
241
1.20
11523
60
18
6.01
59954
60032
1000000
12066
4452
434653
11692
460458
1647
Sum
[ppm]
15000
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com