Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ISP772T
MA001071044
PG-DSO-8-24
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.222
0.009
0.036
0.717
29.121
0.410
0.095
4.378
43.115
0.814
0.650
0.170
0.801
Average
Mass
[%]
3.86
0.01
0.04
0.86
34.86
0.49
0.11
5.24
51.62
0.97
0.78
0.20
0.96
29. August 2013
83.54 mg
Sum
[%]
3.86
Average
Mass
[ppm]
38569
107
429
8585
35.77
0.49
348596
4904
1139
52409
56.97
0.97
0.78
516115
9742
7784
2034
1.16
9587
11621
1000000
569663
9742
7784
357717
4904
Sum
[ppm]
38569
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
