Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPZ65R019C7
MA001070634
PG-TO247-4-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
35.362
4.114
1.234
4108.679
18.247
19.695
374.213
1575.633
23.087
1.945
1.244
3.111
8.089
Average
Mass
[%]
0.57
0.07
0.02
66.54
0.30
0.32
6.06
25.52
0.37
0.03
0.02
0.05
0.13
29. August 2013
6174.65 mg
Sum
[%]
0.57
Average
Mass
[ppm]
5727
666
200
66.63
0.30
665410
2955
3190
60605
31.90
0.37
0.03
255177
3739
315
202
504
0.20
1310
2016
1000000
318972
3739
315
666276
2955
Sum
[ppm]
5727
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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