Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB65R045C7
MA001043894
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
15.501
0.304
0.091
304.026
8.325
10.058
110.638
549.838
9.657
0.228
0.001
0.230
0.184
8.772
0.165
0.548
547.666
Average
Mass
[%]
0.99
0.02
0.01
19.41
0.53
0.64
7.06
35.11
0.62
0.01
0.00
0.01
0.01
0.56
0.01
0.04
34.97
29. August 2013
1566.23 mg
Sum
[%]
0.99
Average
Mass
[ppm]
9897
194
58
19.44
0.53
194113
5315
6422
70640
42.81
0.62
351058
6166
146
0.01
1
147
117
0.58
5600
105
350
35.02
349671
350126
1000000
5864
146
428121
6166
194365
5315
Sum
[ppm]
9897
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com