Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IKW25N120T2
MA000986846
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
11.718
0.530
0.159
529.068
6.539
19.934
378.740
1594.694
31.874
29.065
0.665
1.662
4.322
3.442
1.033
3438.006
Average
Mass
[%]
0.19
0.01
0.00
8.74
0.11
0.33
6.26
26.35
0.53
0.48
0.01
0.03
0.07
0.06
0.02
56.81
29. August 2013
6051.45 mg
Sum
[%]
0.19
Average
Mass
[ppm]
1936
88
26
8.75
0.11
87428
1081
3294
62587
32.94
0.53
0.48
263522
5267
4803
110
275
0.11
714
569
171
56.89
568129
568869
1000000
1099
329403
5267
4803
87542
1081
Sum
[ppm]
1936
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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