Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB70N10S3-12
MA000389811
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.755
0.853
0.256
851.691
5.306
8.795
96.749
480.815
9.657
0.228
0.001
0.082
0.065
3.127
Average
Mass
[%]
0.39
0.06
0.02
58.20
0.36
0.60
6.61
32.86
0.66
0.02
0.00
0.01
0.00
0.21
29. August 2013
1463.38 mg
Sum
[%]
0.39
Average
Mass
[ppm]
3933
583
175
58.28
0.36
582003
3626
6010
66113
40.07
0.66
328564
6599
156
0.02
0
56
45
0.22
2137
2238
1000000
156
400687
6599
582761
3626
Sum
[ppm]
3933
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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