Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB80N04S3-03
MA000366322
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
6.365
0.853
0.256
851.691
6.718
8.768
96.446
479.307
9.657
0.228
0.001
0.076
0.095
3.612
Average
Mass
[%]
0.43
0.06
0.02
58.15
0.46
0.60
6.59
32.74
0.66
0.02
0.00
0.01
0.01
0.25
29. August 2013
1464.07 mg
Sum
[%]
0.43
Average
Mass
[ppm]
4347
582
175
58.23
0.46
581728
4589
5989
65875
39.93
0.66
327379
6596
156
0.02
0
52
65
0.27
2467
2584
1000000
156
399243
6596
582485
4589
Sum
[ppm]
4347
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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