Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
IDH06G65C5
MA000989322
PG-TO220-2-1
Material Group
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
< 10%
Substances
siliconcarbide
gold
tin
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
iron
phosphorus
copper
CAS#
if applicable
409-21-2
7440-57-5
7440-31-5
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.475
0.036
0.009
0.753
0.226
751.797
0.447
9.111
100.219
498.059
14.487
0.198
0.000
0.590
0.177
589.466
Average
Mass
[%]
0.02
0.00
0.00
0.04
0.01
38.25
0.02
0.46
5.10
25.33
0.74
0.01
0.00
0.03
0.01
29.98
29. August 2013
1966.05 mg
Sum
[%]
Average
Mass
[ppm]
242
18
0.02
5
383
115
38.30
0.02
382390
227
4634
50975
30.89
0.74
253329
7368
101
0.01
1
300
90
30.02
299822
300212
1000000
101
308938
7368
382889
227
265
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
Microchip MCU
京公网安备 11010802033920号
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