Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE3B0365J
MA000981080
PG-DIP-8-13
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.248
0.054
0.215
4.297
174.475
0.269
1.097
35.464
329.045
7.496
0.796
0.217
1.230
Average
Mass
[%]
0.40
0.01
0.04
0.77
31.33
0.05
0.20
6.37
59.08
1.35
0.14
0.04
0.22
29. August 2013
556.90 mg
Sum
[%]
0.40
Average
Mass
[ppm]
4037
96
386
7716
32.15
0.05
313296
483
1969
63680
65.65
1.35
0.14
590850
13460
1429
390
0.26
2208
2598
1000000
656499
13460
1429
321494
483
Sum
[ppm]
4037
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com