Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC164CS-32F20F BB-A
MA000964770
PG-TQFP-100-5
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
33.010
0.282
1.222
5.638
180.785
2.954
2.300
62.107
395.643
6.201
3.477
1.215
4.859
Average
Mass
[%]
4.72
0.04
0.17
0.81
25.84
0.42
0.33
8.88
56.54
0.89
0.50
0.17
0.69
29. August 2013
699.69 mg
Sum
[%]
4.72
Average
Mass
[ppm]
47177
403
1746
8058
26.86
0.42
258378
4222
3288
88763
65.75
0.89
0.50
565452
8862
4970
1736
0.86
6945
8681
1000000
657503
8862
4970
268585
4222
Sum
[ppm]
47177
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
电子竞赛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
