Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDP45E60
MA000734808
PG-TO220-2-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
phosphorus
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
CAS#
if applicable
7440-21-3
7723-14-0
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
2.355
0.403
1.343
1341.263
5.480
5.980
113.611
478.360
14.487
0.198
0.000
0.076
0.190
0.495
Average
Mass
[%]
0.12
0.02
0.07
68.29
0.28
0.30
5.78
24.35
0.74
0.01
0.00
0.00
0.01
0.03
29. August 2013
1964.24 mg
Sum
[%]
0.12
Average
Mass
[ppm]
1199
205
684
68.38
0.28
682841
2790
3044
57839
30.43
0.74
243534
7375
101
0.01
0
39
97
0.04
252
388
1000000
101
304418
7375
683729
2790
Sum
[ppm]
1199
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com