Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX20001MB V33
MA000633418
PG-SCT595-5-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.294
0.001
0.006
0.018
6.019
0.030
0.055
0.069
0.138
1.257
5.386
0.335
0.142
0.021
0.097
Average
Mass
[%]
2.12
0.01
0.04
0.13
43.39
0.22
0.40
0.50
1.00
9.06
38.84
2.42
1.02
0.15
0.70
29. August 2013
13.87 mg
Sum
[%]
2.12
Average
Mass
[ppm]
21171
87
436
1308
43.57
0.22
434049
2152
3984
4979
9959
90625
49.80
2.42
1.02
388394
24189
10205
1481
0.85
6981
8462
1000000
497941
24189
10205
435880
2152
Sum
[ppm]
21171
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
stm32/stm8
京公网安备 11010802033920号
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