Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ITS436L2S
MA000222156
PG-TO220-5-12
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
phosphorus
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
5.066
1.513
0.454
1511.033
3.827
6.107
12.769
14.435
105.487
416.397
23.910
0.008
3.285
0.282
0.705
1.834
Average
Mass
[%]
0.24
0.07
0.02
71.71
0.18
0.29
0.61
0.69
5.01
19.76
1.13
0.00
0.16
0.01
0.03
0.09
29. August 2013
2107.11 mg
Sum
[%]
0.24
Average
Mass
[ppm]
2404
718
215
71.80
0.18
717112
1816
2898
6060
6851
50062
26.36
1.13
197615
11347
4
0.16
1559
134
335
0.13
870
1339
1000000
1563
263486
11347
718045
1816
Sum
[ppm]
2404
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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