Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB60R600C6
MA001096724
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.063
0.304
0.091
304.026
0.719
10.331
113.637
564.743
9.657
0.228
0.001
0.071
0.057
2.702
0.165
0.548
547.666
Average
Mass
[%]
0.20
0.02
0.01
19.51
0.05
0.66
7.29
36.26
0.62
0.01
0.00
0.00
0.00
0.17
0.01
0.04
35.15
29. August 2013
1558.01 mg
Sum
[%]
0.20
Average
Mass
[ppm]
1966
195
59
19.54
0.05
195137
462
6631
72937
44.21
0.62
362478
6198
147
0.01
1
45
36
0.17
1734
106
352
35.20
351516
351974
1000000
1815
147
442047
6198
195391
462
Sum
[ppm]
1966
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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