Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP50R199CP
MA000908604
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
8.809
0.816
0.245
815.335
2.709
5.894
111.987
471.525
21.462
0.244
0.001
0.420
1.049
2.727
0.590
0.177
589.466
Average
Mass
[%]
0.43
0.04
0.01
40.10
0.13
0.29
5.51
23.19
1.06
0.01
0.00
0.02
0.05
0.13
0.03
0.01
28.99
29. August 2013
2033.46 mg
Sum
[%]
0.43
Average
Mass
[ppm]
4332
401
120
40.15
0.13
400960
1332
2899
55072
28.99
1.06
231884
10555
120
0.01
1
206
516
0.20
1341
290
87
29.03
289884
290261
1000000
2063
120
289855
10555
401482
1332
Sum
[ppm]
4332
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com