Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP60R250CP
MA000894144
PG-TO220-3-123
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
7.176
0.816
0.245
815.335
1.411
2.342
67.923
515.279
21.462
1.764
0.363
0.907
2.358
0.590
0.177
589.466
Average
Mass
[%]
0.35
0.04
0.01
40.21
0.07
0.12
3.35
25.41
1.06
0.09
0.02
0.04
0.12
0.03
0.01
29.07
29. August 2013
2027.62 mg
Sum
[%]
0.35
Average
Mass
[ppm]
3539
403
121
40.26
0.07
402115
696
1155
33499
28.88
1.06
0.09
254131
10585
870
179
447
0.18
1163
291
87
29.11
290719
291097
1000000
1789
288785
10585
870
402639
696
Sum
[ppm]
3539
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
京公网安备 11010802033920号
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