Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI041N12N3 G
MA000800818
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
17.562
0.957
0.287
955.892
11.413
8.554
94.095
467.625
15.198
0.228
0.001
0.207
0.166
7.907
Average
Mass
[%]
1.11
0.06
0.02
60.51
0.72
0.54
5.96
29.59
0.96
0.01
0.00
0.01
0.01
0.50
29. August 2013
1580.09 mg
Sum
[%]
1.11
Average
Mass
[ppm]
11115
606
182
60.59
0.72
604959
7223
5414
59550
36.09
0.96
295948
9618
145
0.01
0
131
105
0.52
5004
5240
1000000
145
360912
9618
605747
7223
Sum
[ppm]
11115
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
DSP 与 ARM 处理器
京公网安备 11010802033920号
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