Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW60R330P6
MA001136532
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
5.001
0.530
0.159
529.068
4.428
20.017
380.327
1601.375
31.874
29.065
0.280
0.699
1.818
1.033
3.442
3438.006
Average
Mass
[%]
0.08
0.01
0.00
8.75
0.07
0.33
6.29
26.48
0.53
0.48
0.00
0.01
0.03
0.02
0.06
56.86
29. August 2013
6047.12 mg
Sum
[%]
0.08
Average
Mass
[ppm]
827
88
26
8.76
0.07
87491
732
3310
62894
33.10
0.53
0.48
264816
5271
4806
46
116
0.04
301
171
569
56.94
568536
569276
1000000
463
331020
5271
4806
87605
732
Sum
[ppm]
827
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com