Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC2268N-40F80L AA
MA001059314
PG-LQFP-100-8
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
28.688
0.069
0.275
5.501
223.351
2.532
2.362
63.786
406.340
9.288
2.495
2.161
6.482
Average
Mass
[%]
3.81
0.01
0.04
0.73
29.65
0.34
0.31
8.47
53.93
1.23
0.33
0.29
0.86
29. August 2013
753.33 mg
Sum
[%]
3.81
Average
Mass
[ppm]
38081
91
365
7302
30.43
0.34
296485
3361
3136
84672
62.71
1.23
0.33
539392
12330
3312
2868
1.15
8605
11473
1000000
627200
12330
3312
304243
3361
Sum
[ppm]
38081
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
