Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP060N06N
MA000963520
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
7.602
1.407
0.422
1404.801
3.208
8.864
97.499
484.541
21.462
0.244
0.001
0.454
0.363
17.327
Average
Mass
[%]
0.37
0.07
0.02
68.58
0.16
0.43
4.76
23.66
1.05
0.01
0.00
0.02
0.02
0.85
29. August 2013
2048.19 mg
Sum
[%]
0.37
Average
Mass
[ppm]
3711
687
206
68.67
0.16
685873
1566
4328
47603
28.85
1.05
236570
10479
119
0.01
0
221
177
0.89
8460
8858
1000000
119
288501
10479
686766
1566
Sum
[ppm]
3711
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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