Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP100N04S2L-03
MA000275871
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
12.294
0.816
0.245
815.335
7.694
8.773
96.500
479.577
21.462
0.244
0.001
0.192
0.154
7.350
0.177
0.590
589.466
Average
Mass
[%]
0.60
0.04
0.01
39.95
0.38
0.43
4.73
23.50
1.05
0.01
0.00
0.01
0.01
0.36
0.01
0.03
28.88
29. August 2013
2040.87 mg
Sum
[%]
0.60
Average
Mass
[ppm]
6024
400
120
40.00
0.38
399503
3770
4299
47284
28.66
1.05
234986
10516
120
0.01
1
94
75
0.38
3602
87
289
28.92
288830
289206
1000000
3771
120
286569
10516
400024
3770
Sum
[ppm]
6024
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com