Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IKD03N60RF
MA000942942
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
0.433
0.147
0.044
147.096
0.168
1.435
25.119
116.981
3.740
0.003
1.421
0.015
0.012
0.582
0.019
0.006
19.177
Average
Mass
[%]
0.14
0.05
0.01
46.51
0.05
0.45
7.94
36.97
1.18
0.00
0.45
0.00
0.00
0.18
0.01
0.00
6.06
29. August 2013
316.40 mg
Sum
[%]
0.14
Average
Mass
[ppm]
1370
466
140
46.57
0.05
464906
530
4536
79389
45.36
1.18
369724
11821
11
0.45
4490
48
39
0.18
1840
61
18
6.07
60611
60690
1000000
1927
4501
453649
11821
465512
530
Sum
[ppm]
1370
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com