Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB107N20NA
MA000898802
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
17.562
0.853
0.256
851.691
11.765
8.544
93.988
467.093
9.657
0.228
0.001
0.255
0.204
9.743
Average
Mass
[%]
1.19
0.06
0.02
57.85
0.80
0.58
6.39
31.74
0.66
0.02
0.00
0.02
0.01
0.66
29. August 2013
1471.84 mg
Sum
[%]
1.19
Average
Mass
[ppm]
11932
579
174
57.93
0.80
578658
7993
5805
63858
38.71
0.66
317354
6561
155
0.02
0
173
139
0.69
6619
6931
1000000
155
387017
6561
579411
7993
Sum
[ppm]
11932
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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