Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB107N20N3 G
MA000811362
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
17.562
0.853
0.256
851.691
11.929
8.547
94.019
467.248
9.657
0.228
0.001
0.207
0.166
7.907
Average
Mass
[%]
1.19
0.06
0.02
57.93
0.81
0.58
6.39
31.78
0.66
0.02
0.00
0.01
0.01
0.54
29. August 2013
1470.27 mg
Sum
[%]
1.19
Average
Mass
[ppm]
11945
580
174
58.01
0.81
579275
8114
5813
63947
38.75
0.66
317797
6568
155
0.02
0
141
113
0.56
5378
5632
1000000
155
387557
6568
580029
8114
Sum
[ppm]
11945
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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