Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA075N15N3 G
MA000771286
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
17.562
1.120
0.336
1118.332
10.806
2.160
203.075
874.949
7.942
0.305
0.001
0.584
1.460
3.796
Average
Mass
[%]
0.78
0.05
0.02
49.86
0.48
0.10
9.06
39.02
0.35
0.01
0.00
0.03
0.07
0.17
29. August 2013
2242.43 mg
Sum
[%]
0.78
Average
Mass
[ppm]
7832
499
150
49.93
0.48
498715
4819
963
90560
48.18
0.35
390180
3542
136
0.01
0
260
651
0.27
1693
2604
1000000
136
481703
3542
499364
4819
Sum
[ppm]
7832
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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