Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI032N06N3 G
MA000739528
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
6.442
0.957
0.287
955.892
9.684
8.725
95.974
476.960
15.198
0.228
0.001
0.116
0.093
4.430
Average
Mass
[%]
0.41
0.06
0.02
60.71
0.61
0.55
6.09
30.28
0.96
0.01
0.00
0.01
0.01
0.28
29. August 2013
1574.99 mg
Sum
[%]
0.41
Average
Mass
[ppm]
4090
608
182
60.79
0.61
606921
6149
5540
60936
36.92
0.96
302834
9649
145
0.01
0
74
59
0.30
2813
2946
1000000
145
369310
9649
607711
6149
Sum
[ppm]
4090
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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