Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX25401TB V50
MA000722498
PG-TO263-5-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.304
0.483
0.145
482.096
0.305
1.456
66.973
659.536
12.370
0.243
0.001
0.122
0.098
4.658
0.133
0.442
441.456
Average
Mass
[%]
0.20
0.03
0.01
28.80
0.02
0.09
4.00
39.39
0.74
0.01
0.00
0.01
0.01
0.28
0.01
0.03
26.37
29. August 2013
1673.82 mg
Sum
[%]
0.20
Average
Mass
[ppm]
1974
288
87
28.84
0.02
288022
182
870
40012
43.48
0.74
394030
7390
145
0.01
1
73
58
0.30
2783
79
264
26.41
263742
264085
1000000
2914
145
434913
7390
288397
182
Sum
[ppm]
1974
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com