Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDH05S120
MA000622908
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
siliconcarbide
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
409-21-2
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
3.465
1.343
0.403
1341.263
0.683
9.070
99.768
495.819
14.487
0.198
0.000
0.105
0.084
3.994
Average
Mass
[%]
0.18
0.07
0.02
68.06
0.03
0.46
5.06
25.16
0.74
0.01
0.00
0.01
0.00
0.20
29. August 2013
1970.68 mg
Sum
[%]
0.18
Average
Mass
[ppm]
1758
681
204
68.15
0.03
680611
347
4602
50626
30.68
0.74
251598
7351
100
0.01
0
53
42
0.21
2027
2122
1000000
100
306826
7351
681496
347
Sum
[ppm]
1758
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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