Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB016N06L3 G
MA000472884
PG-TO263-7-3
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
10.427
0.909
0.273
907.924
13.010
8.642
95.060
472.421
12.317
0.269
0.001
0.108
0.135
5.174
Average
Mass
[%]
0.68
0.06
0.02
59.46
0.85
0.57
6.23
30.94
0.81
0.02
0.00
0.01
0.01
0.34
29. August 2013
1526.67 mg
Sum
[%]
0.68
Average
Mass
[ppm]
6830
595
179
59.54
0.85
594709
8522
5661
62266
37.74
0.81
309445
8068
176
0.02
0
71
89
0.36
3389
3549
1000000
176
377372
8068
595483
8522
Sum
[ppm]
6830
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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