Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPI120N04S3-02
MA000361816
PG-TO262-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
12.237
0.851
0.255
849.682
11.412
8.622
94.844
471.345
15.198
0.228
0.001
0.189
0.151
7.224
0.032
0.106
106.210
Average
Mass
[%]
0.78
0.05
0.02
53.82
0.72
0.55
6.01
29.86
0.96
0.01
0.00
0.01
0.01
0.46
0.00
0.01
6.73
29. August 2013
1578.59 mg
Sum
[%]
0.78
Average
Mass
[ppm]
7752
539
162
53.89
0.72
538254
7229
5462
60081
36.42
0.96
298587
9627
145
0.01
1
120
96
0.48
4576
20
67
6.74
67282
67369
1000000
4792
145
364130
9627
538956
7229
Sum
[ppm]
7752
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com