NSR0630P2T5G
Schottky Barrier Diode
Schottky barrier diodes are optimized for very low forward voltage
drop and low leakage current and are used in a wide range of dc−dc
converter, clamping and protection applications in portable devices.
NSR0630P2 in a SOD−923 miniature package enables designers to
meet the challenging task of achieving higher efficiency and meeting
reduced space requirements.
Features
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•
•
•
•
•
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Very Low Forward Voltage Drop − 370 mV @ 100 mA
Low Reverse Current − 1.4
mA
@ 10 V VR
600 mA of Continuous Forward Current
Power Dissipation of 190 mW with Minimum Trace
Very High Switching Speed
Low Capacitance − CT = 10 pF
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
2
30 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
Typical Applications
MARKING
DIAGRAM
1
6F MG
G
•
•
•
•
•
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
SOD−923
CASE 514AB
1
2
Markets
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
6F = Specific Device Code
M = Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NSR0630P2T5G
Package
SOD−923
(Pb−Free)
Shipping†
2 mm Pitch
8000/Tape & Reel
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
ESD Rating:
Human Body Model
Machine Model
Symbol
V
R
I
F
ESD
Value
30
600
Class 3B
Class C
Unit
V
mA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2014
1
April, 2014 − Rev. 0
Publication Order Number:
NSR0630P2/D
NSR0630P2T5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Junction and Storage Temperature Range
Symbol
R
qJA
P
D
R
qJA
P
D
T
J
, T
stg
Min
Typ
Max
520
190
175
570
−55 to +125
Unit
°C/W
mW
°C/W
mW
°C
1. Mounted onto a 4 in square FR−4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 30 V)
Forward Voltage (I
F
= 10 mA)
(I
F
= 100 mA)
(I
F
= 500 mA)
Total Capacitance
(V
R
= 1.0 V, f = 1 MHz)
Symbol
I
R
1.4
24
V
F
0.28
0.37
0.52
10
10
200
0.37
0.46
0.62
V
Min
Typ
Max
Unit
mA
CT
pF
10,000
I
F
, FORWARD CURRENT (mA)
1000
100
10
125°C
1
0.1
85°C
25°C
0
0.1
−40°C
0.2
0.3
0.4
0.5
0.6
1,000,000
100,000
I
r
, REVERSE CURRENT (mA)
10,000
1000
100
10
1
0.1
0.01
0.001
0
5
10
15
20
25
30
35
V
R
, REVERSE VOLTAGE (V)
−40°C
125°C
85°C
25°C
0.01
0.001
V
F
, FORWARD VOLTAGE (V)
Figure 1. Forward Voltage
20
C
T
, TOTAL CAPACITANCE (pF)
18
16
14
12
10
8
6
4
2
0
0
5
10
15
20
25
30
T
A
= 25°C
Figure 2. Leakage Current
35
V
R
, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance
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2
NSR0630P2T5G
PACKAGE DIMENSIONS
SOD−923
CASE 514AB
ISSUE C
−X−
D
−Y−
E
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
INCHES
MIN
NOM MAX
0.013 0.015 0.016
0.006 0.008 0.010
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.007 REF
0.002 0.004 0.006
b
0.08 X Y
2X
TOP VIEW
A
c
H
E
SIDE VIEW
SOLDERING FOOTPRINT*
2X
L
2X
1.20
2X
0.36
0.25
2X
L2
BOTTOM VIEW
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
See Application Note AND8455/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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NSR0630P2/D
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