Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPG20N06S4L-26A
MA001064376
PG-TDSON-8-10
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
1.567
0.046
0.014
46.380
0.719
0.091
6.451
38.889
1.396
0.001
0.603
0.048
0.060
2.278
Average
Mass
[%]
1.59
0.05
0.01
47.07
0.73
0.09
6.55
39.46
1.42
0.00
0.61
0.05
0.06
2.31
29. August 2013
98.54 mg
Sum
[%]
1.59
Average
Mass
[ppm]
15898
471
141
47.13
0.73
470655
7297
922
65466
46.10
1.42
394637
14170
15
0.61
6120
484
605
2.42
23119
24208
1000000
6135
461025
14170
471267
7297
Sum
[ppm]
15898
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
