Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
ICE3AR2280JZ-T
MA001049472
PG-DIP-7-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
4.427
0.048
0.194
3.872
157.218
0.392
2.345
63.316
403.344
6.460
1.594
0.354
1.671
Average
Mass
[%]
0.69
0.01
0.03
0.60
24.37
0.06
0.36
9.81
62.51
1.00
0.25
0.05
0.26
29. August 2013
645.23 mg
Sum
[%]
0.69
Average
Mass
[ppm]
6861
75
300
6001
25.01
0.06
243660
607
3634
98128
72.68
1.00
0.25
625113
10011
2471
549
0.31
2590
3139
1000000
726875
10011
2471
250036
607
Sum
[ppm]
6861
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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