Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BSS159N H6327
MA000919342
PG-SOT23-3-5
Material Group
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
tin
silicon
chromium
silicon
titanium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.008
0.002
0.091
0.009
0.001
0.003
3.000
0.008
0.058
1.240
4.471
0.150
0.284
Average
Mass
[%]
0.09
0.02
0.97
0.10
0.01
0.03
32.18
0.08
0.62
13.30
47.95
1.60
3.05
29. August 2013
9.32 mg
Sum
[%]
Average
Mass
[ppm]
860
222
1.08
9745
969
65
323
32.32
0.08
321774
832
6187
133012
61.87
1.60
3.05
479461
16048
30502
618660
16048
30502
1000000
323131
832
10827
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
DSP 与 ARM 处理器
京公网安备 11010802033920号
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