Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7741G
MA000913616
PG-DSO-28-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
7.005
0.072
0.288
5.754
233.637
1.732
1.106
79.075
472.794
4.913
0.196
0.000
0.678
0.403
1.901
Average
Mass
[%]
0.87
0.01
0.04
0.71
28.86
0.21
0.14
9.77
58.40
0.61
0.02
0.00
0.08
0.05
0.23
29. August 2013
809.56 mg
Sum
[%]
0.87
Average
Mass
[ppm]
8653
89
355
7108
29.62
0.21
288599
2140
1366
97678
68.31
0.61
584016
6069
243
1
0.10
837
498
0.28
2348
2846
1000000
1081
683060
6069
296151
2140
Sum
[ppm]
8653
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
ARM技术
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