Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS50055-1TMB
MA000907884
PG-TO220-7-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
15.514
1.492
0.447
1489.617
6.565
8.688
95.569
474.947
23.005
0.216
0.001
0.217
0.203
0.162
7.743
Average
Mass
[%]
0.73
0.07
0.02
70.12
0.31
0.41
4.50
22.36
1.08
0.01
0.00
0.01
0.01
0.01
0.36
29. August 2013
2124.39 mg
Sum
[%]
0.73
Average
Mass
[ppm]
7303
702
211
70.21
0.31
701199
3090
4090
44987
27.27
1.08
223569
10829
102
0.01
0.01
0
102
95
76
0.38
3645
3816
1000000
102
102
272646
10829
702112
3090
Sum
[ppm]
7303
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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