Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
leadfinish
plating
glue
solder
BSB008NE2LX
MA000944590
MG-WDSON-2-8
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
plastics
noble metal
non noble metal
noble metal
non noble metal
plastics
< 10%
Substances
silicon
copper
nickel
silver
nickel
epoxy resin
silver
copper
silver
tin
epoxy resin
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
7440-22-4
7440-02-0
-
7440-22-4
7440-50-8
7440-22-4
7440-31-5
-
Issued
Weight*
Weight
[mg]
6.356
74.415
0.211
0.840
0.211
0.254
1.561
0.011
0.066
2.119
0.393
Average
Mass
[%]
7.35
86.11
0.24
0.97
0.24
0.29
1.81
0.01
0.08
2.45
0.45
29. August 2013
86.44 mg
Sum
[%]
7.35
86.11
Average
Mass
[ppm]
73538
860916
2443
1.21
0.24
9718
2443
2940
2.10
18058
127
762
2.54
0.45
24510
4545
25399
4545
1000000
20998
12161
2443
Sum
[ppm]
73538
860916
passivation
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
