Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BGA 915N7 E6327
MA000943978
PG-TSNP-7-6
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
Substances
silicon
zinc
tin
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-66-6
7440-31-5
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.108
0.002
0.002
0.003
0.939
0.025
0.005
0.133
0.782
0.066
0.020
0.013
0.051
Average
Mass
[%]
5.01
0.09
0.11
0.13
43.72
1.16
0.21
6.21
36.40
3.09
0.91
0.59
2.37
29. August 2013
2.15 mg
Sum
[%]
5.01
Average
Mass
[ppm]
50090
881
1101
1322
44.05
1.16
437140
11551
2141
62092
42.82
3.09
0.91
363986
30865
9149
5937
2.96
23745
29682
1000000
428219
30865
9149
440444
11551
Sum
[ppm]
50090
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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