Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BFR 360F H6327
MA000895772
PG-TSFP-3-1
Material Group
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
tin
gold
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.002
0.016
0.000
0.001
0.002
0.570
0.004
0.008
0.168
0.605
0.033
0.025
Average
Mass
[%]
0.03
0.13
1.10
0.01
0.04
0.12
39.78
0.29
0.54
11.70
42.19
2.33
1.74
29. August 2013
1.43 mg
Sum
[%]
Average
Mass
[ppm]
324
1258
1.26
10967
80
400
1199
39.95
0.29
397771
2949
5444
117031
54.43
2.33
1.74
421858
23348
17371
544333
23348
17371
1000000
399450
2949
12549
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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