Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BB 844 E6327
MA000387207
PG-SOT23-3-3
Material Group
non noble metal
noble metal
inorganic material
non noble metal
non noble metal
noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
arsenic
gold
silicon
nickel
iron
gold
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-38-2
7440-57-5
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.000
0.016
0.137
1.142
1.578
0.016
0.089
0.133
0.167
1.389
3.777
0.150
0.107
Average
Mass
[%]
0.00
0.18
1.57
13.13
18.13
0.18
1.02
1.53
1.92
15.96
43.43
1.72
1.23
29. August 2013
8.70 mg
Sum
[%]
Average
Mass
[ppm]
19
1844
1.75
15747
131307
31.26
0.18
181329
1811
10215
15323
19154
159613
63.86
1.72
1.23
434148
17200
12290
638453
17200
12290
1000000
312636
1811
17610
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com