3. Surface−mounted on FR4 board using the minimum recommended pad size, 1 oz Cu.
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise specified)
Parameter
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Zero Gate Voltage Drain Current
I
DSS
V
GS
= 0 V, V
DS
= 5 V
V
GS
= 0 V, V
DS
= 16 V
Gate−to−Source Leakage Current
ON CHARACTERISTICS
(Note 4)
Gate Threshold Voltage
Drain−to−Source On Resistance
R
DS(ON)
V
GS(TH)
V
GS
= V
DS
, I
D
= 250
mA
V
GS
= 4.5 V, I
D
= 100 mA
V
GS
= 2.5 V, I
D
= 50 mA
V
GS
= 1.8 V, I
D
= 20 mA
V
GS
= 1.5 V, I
D
= 10 mA
Forward Transconductance
Forward Diode Voltage
CAPACITANCES
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
ISS
C
OSS
C
RSS
f = 1 MHz, V
GS
= 0 V
V
DS
= 15 V
12.3
3.4
2.5
pF
g
FS
V
SD
V
DS
= 5.0 V, I
D
= 125 mA
V
GS
= 0 V, I
S
= 10 mA
0.4
0.8
1.1
1.4
1.8
0.48
0.6
1.0
1.0
1.5
2.0
3.0
4.5
S
V
W
V
I
GSS
V
(BR)DSS
V
GS
= 0 V, I
D
= 250
mA
T
J
= 25°C
T
J
= 85°C
T
J
= 25°C
20
50
200
100
±100
nA
nA
V
nA
Symbol
Test Condition
Min
Typ
Max
Unit
V
DS
= 0 V, V
GS
=
±5.0
V
SWITCHING CHARACTERISTICS, V
GS
= 4.5 V
(Note 4)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
t
d(ON)
t
r
t
d(OFF)
t
f
V
GS
= 4.5 V, V
DD
= 10 V,
I
D
= 200 mA, R
G
= 3
W
16.5
25.5
142
80
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Switching characteristics are independent of operating junction temperatures.
ORDERING INFORMATION
Device
NTND31015NZTAG
Package
XLLGA6
(Pb−Free)
Shipping
†
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
NTND31015NZ
TYPICAL CHARACTERISTICS
0.4
5 V to
1.8 V
I
D
, DRAIN CURRENT (A)
0.3
V
GS
= 1.6 V
0.4
V
DS
= 5 V
I
D
, DRAIN CURRENT (A)
0.3
0.2
1.4 V
0.2
0.1
1.2 V
0.1
T
J
= −55°C
T
J
= 25°C
T
J
= 125°C
0.0
0.0
1.0
2.0
3.0
T
J
= 25°C
4.0
5.0
0.0
0
0.4
0.8
1.2
1.6
2
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
5.0
R
DS(on)
, DRAIN−TO−SOURCE
RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE
RESISTANCE (mW)
T
J
= 25°C
I
D
= 0.22 A
5.0
Figure 2. Transfer Characteristics
T
J
= 25°C
4.0
V
GS
= 1.5 V
4.0
3.0
3.0
V
GS
= 1.8 V
V
GS
= 2.5 V
V
GS
= 4.5 V
0
0.1
0.2
0.3
0.4
2.0
2.0
1.0
1.0
0.0
1.0
2.0
3.0
4.0
5.0
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
1.8
R
DS(on)
, DRAIN−TO−SOURCE
RESISTANCE (Normalized)
1.6
1.4
1.2
1.0
0.8
0.6
−50
−25
0
25
50
75
100
125
150
T
J
, JUNCTION TEMPERATURE (°C)
V
GS
= 4.5 V
I
D
= 0.10 A
100.00
I
DSS
, LEAKAGE (nA)
1000.00
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
T
J
= 150°C
T
J
= 125°C
10.00
T
J
= 85°C
1.00
T
J
= 25°C
V
GS
= 0 V
0
5
10
15
20
0.10
0.01
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
NTND31015NZ
TYPICAL CHARACTERISTICS
100
T
J
= 25°C
V
GS
= 0 V
f = 1 MHz
100
C
iss
10
C
oss
C
rss
t, TIME (ns)
V
DS
= 10 V
I
D
= 0.2 A, V
GS
= 4.5 V
t
d(off)
t
f
C, CAPACITANCE (pF)
t
r
t
d(on)
10
1
0
5
10
15
20
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
1
10
R
G
, GATE RESISTANCE (W)
100
Figure 7. Capacitance Variation
0.20
V
GS
= 0 V
I
S
, SOURCE CURRENT (A)
I
D
, DRAIN CURRENT (A)
1
Figure 8. Resistive Switching Time Variation
vs. Gate Resistance
10
ms
0.1
100
ms
1 ms
0.01
V
GS
< 4.5 V
T
A
= 25°C
Single Pulse Response
R
DS(on)
Limit
Thermal Limit
Package Limit
0.1
1
10
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
100
10 ms
dc
T
J
= 25°C
T
J
= 125°C
T
J
= −55°C
0.02
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
V
SD
, SOURCE−TO−DRAIN VOLTAGE (V)
0.001
Figure 9. Diode Forward Voltage vs. Current
Figure 10. Maximum Rated Forward Biased
Safe Operating Area
R
qWJA(t)
, EFFECTIVE TRANSIENT THERMAL
RESISTANCE (°C/W)
1000
50% Duty Cycle
20%
10%
5%
2%
1%
Single Pulse
100
10
1
0.000001
0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
100
1000
Figure 11. Thermal Response
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4
NTND31015NZ
PACKAGE DIMENSIONS
XLLGA6 0.90x0.65
CASE 713AC
ISSUE O
D
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. POSITIONAL TOERANCE APPLIES TO ALL
SIX LEADS.
DIM
A
A1
b
b2
D
E
e
e1
e2
e3
e4
L
L2
MILLIMETERS
MIN
MAX
0.340 0.440
0.000 0.050
0.200 0.300
0.080 0.180
0.900 BSC
0.650 BSC
0.295 BSC
0.340 BSC
0.300 BSC
0.208 BSC
0.158 BSC
0.215 0.315
0.115 0.215
2X
0.05 C
2X
0.05 C
0.05 C
0.05 C
e2
1
2
3
e3
2X
L
b
2X
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
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Order Literature:
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For additional information, please contact your local
Sales Representative
ÇÇ
ÇÇ
6
PIN ONE
REFERENCE
E
TOP VIEW
A
A1
SIDE VIEW
C
SEATING
PLANE
e1
e
e4
4X
RECOMMENDED
SOLDERING FOOTPRINT*
L2
0.345
PITCH
2X
0.300
PITCH
4X
0.300
5
4
4X
0.300
b2
0.10
0.05
M
M
C A B
C
NOTE 3
2X
BOTTOM VIEW
0.781
1
0.400
4X
0.180
0.340
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
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