Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW90R500C3
MA000468410
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
tin
silver
antimony
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-31-5
7440-22-4
7440-36-0
Issued
Weight*
Weight
[mg]
9.945
3.972
1.192
3967.071
4.076
19.973
379.496
1597.877
31.874
28.550
2.459
0.946
0.378
Average
Mass
[%]
0.16
0.07
0.02
65.59
0.07
0.33
6.27
26.42
0.53
0.47
0.04
0.02
0.01
29. August 2013
6047.78 mg
Sum
[%]
0.16
Average
Mass
[ppm]
1644
657
197
65.68
0.07
655951
674
3303
62749
33.02
0.53
0.47
264208
5270
4721
407
156
0.07
63
626
1000000
330259
5270
4721
656806
674
Sum
[ppm]
1644
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com